Description of Wafer
Wafer is a substrate of a semiconductor device “grain” or “chip”, which is cut from a high-purity silicon crystal column (Crystal Ingot) which is stretched and stretched. Called “wafer.” After that, a precise “mask” is used to obtain the desired “light resistance” through the photosensitive process, and then the silicon material is precisely etched into the groove, and the metal vacuum evaporation process is continued, and in the separate “die or chip”. (Die, Chip) completes its various micro components and fine lines. As for the back side of the wafer, a gold layer is additionally evaporated to serve as a die attach to the stand. The above process is called Wafer Fabrication. In the early days of the small integrated circuit, thousands of dies were fabricated on each 6-inch wafer. Nowadays, the large-scale VLSI with sub-micron line width can only complete one or two hundred large ones per 8-inch wafer. Chip. Although Wafer’s manufacturing has invested tens of billions, it is the foundation of all electronics industries.
Wafer, also known as epitaxial, wafer, sapphire substrate, epitaxial wafer. It is a carrier used in the production of integrated circuits and refers to a single crystal silicon wafer. Used for display lighting and LED industry.
Product Details
BrandFJY
TypeBoard to Wire
ShapeBar
CraftsmanshipInjection Molding
FeatureFire Retardant
Insulation MaterialPA66
Pin Number2-16
Fields of ApplicationTelecommunication
Working FrequencyLow Frequency
Interface TypeDIN(Large/Middle/Small)
Length of WireContact us
Custom ProcessingYes
Contact MaterialBrass
Delivery Time: 10-15days
UL: Yes
ROHS Compliant
Scope of Application:
PCB, Display, electronic equipmentStraight Type Wafer quotation
website:http://www.fjyconn.com/wafer-housing-terminal/straight-type-wafer/
